Fastwel CompactPCI

Fastwel CPC503 6U CompactPCI CPU Board

Product description: CPC503 6U CompactPCI CPU module is an embedded computer on x86 platform for use in server or client systems for a wide range of applications. CPC503 is based on 2-nd generation Intel Core i7 (2/4 co
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■For CPC503-01, Intel Core 2nd Gen (2/4 Cores):
■Core i7-2715QE 6 MB 4C 2.1 GHz SV 45 W;
■Core i7-2655LE 4 MB 2C 2.2 GHz LV 25 W;
■Core i7-2610UE 4 MB 2C 1.5 GHz ULV 17 W.
■For CPC503-02, Intel Core 3rd Gen (2/4 Cores):
■Core i7-3612QE 6 MB 4C 2.1 GHz SV 35 W;
■Core i7-3555LE 4 MB 2C 2.5 GHz LV 25 W;
■Core i7-3517UE 4 MB 2C 1.7 GHz ULV 17 W.
■RAM: DDR3 SDRAM 1333 MHz with ECC up to 4 GB, dual channel, soldered (for CPC503-01);
■DDR3L SDRAM 1600 MHz with ECC up to 8 GB, dual channel, soldered (for CPC503-02);
■1x XMC/PMC expansion module
(x8 PCI-E GEN2/GEN3 + 64 bit/133 MHz PCI-X);
■4x Gigabit Ethernet controllers (2x ports switchable between P16 XMC connector and backplane
■2x ports are available at the front panel);
■10x USB 2.0 ports with HS, FS and LS support (4x on front panel, 4x via RIO, 2x on P16 XMC);
■4x SATA II ports (1x for 1.8" HDD, 1x at P16 XMC, 2x via RIO);
■2x Displayport interfaces
(1x on front panel, 1x via RIO);
■1x DVI-I on front panel;
■1x DVI-D via RIO;
■HD Audio via RIO and P16 XMC;
■LPC is routed via RIO, P16 socket;
■Supported OS: Linux 2.6, QNX 6.5, Windows Embedded Standard 7
■Operating temperature range: Industrial: -40°C to +85°C, Commercial: 0°C to +70°C
■MTBF: No less than 60 000

CPC503 6U CompactPCI CPU module is an embedded computer on x86 platform for use in server or client systems

for a wide range of applications. CPC503 is based on 2-nd generation Intel Core i7 (2/4 cores) processors operating

at frequencies from 1.5 to 2.2 GHz and on QM67 Peripheral Controller Hub. Up to 8 GB of DDR3 SDRAM memory with

ECC operating at 1600 MHz is soldered onboard the CPC503.

CPC503 graphics capabilities include VGA, Displayport, DVI, and LVDS interfaces. Four Gigabit Ethernet ports are

used for networking. Interface set of CPC503 also includes 12 USB 2.0 ports, four SATA channels, audio interface

and standard J1-J5 CompactPCI connectors at the rear edge of the board. Fastwel CPC503 supports one XMC/PMC

expansion module mounted onboard and specially designed Fastwel RIO587 rear I/O module. CPC503 provides

one 64-bit 66 MHz CompactPCI interface with hot swap capability. The module interfaces with CompactPCI bus

via the built-in PCI-EPCI bridge, this allows using CPC503 either as master system controller or as a slave device

in one PCI bus segment. One of the features of CPC503 is support for PICMG CompactPCI Packet Switching

Backplane Specification version 2.16. Being installed on a backplane supporting the packet switching mode,

CPC503 can communicate with peripheral devices or with the system master board supporting this mode via

two Gigabit Ethernet ports. The components of CPC503 are carefully selected according to the criteria of

applicability in embedded systems and long-term availability on the market. This makes this module an

ideal device, based on which the systems with long life cycle can be built.

CPC503 is compatible with Windows Embedded Standard 7, QNX 6.5.0, VxWorks 6.8 (on request), and

Linux® 2.6 operating systems.

For CPC503-01
CPU Intel Core 2nd Gen ( 2/4 Cores)
•Core i7-2715QE 6 MB 4C 2.1 GHz SV 45 W
•Core i7-2655LE 4 MB 2C 2.2 GHz LV 25 W
•Core i7-2610UE 4 MB 2C 1.5 GHz ULV 17 W

For CPC503-02
CPU Intel Core 3 rd Gen ( 2/4 Cores)
•Core i7-3612QE 6 MB 4C 2.1 GHz SV 35 W
•Core i7-3555LE 4 MB 2C 2.5 GHz LV 25 W
•Core i7-3517UE 4 MB 2C 1.7 GHz ULV 17 W

PCH QM67 chipset (QM77)
•Highly integrated interface controller including standard peripherals of IBM PC AT platform

RAM
•DDR3 SDRAM 1333 MHz with ECC up to 4 GB, dual channel, soldered (for CPC503-01)
•DDR3L SDRAM 1600 MHz with ECC up to 8 GB, dual channel, soldered (for CPC503-02)

Video-output
•DVI-connector (VGA [2048x1536@75 Hz], DVI-D[1920x1200@60 Hz] routed to the front panel
•DisplayPort interface (resolution up to 2560x1600@60 Hz) routed to the front panel
•DisplayPort interface (resolution up to 2560x1600@60 Hz) routed to RIO
•Embedded Display Port interface, routed to RIO
•Simultaneous operation of two interfaces is possible (for CPC503-01)
•Simultaneous operation of three interfaces is possible (for CPC503-02)

PCI bus
•Routed to Compact PCI J1/J2 connectors
•64 bit/ 66 MHz
•Implemented on PCI-E bridge ->PCI-X PI7C9X130
•Operation in a non-system slot (Non-Transparent Bridge mode)

LPC bus
•Routed to P16 XMC connector
•Routed to RIO

PCI-E bus (for CPC503-01)
•Support of PCI-E 2.0 (up to 5 GT/s), routed to P15 XMC connector supporting up to x8 devices
•PCI-E 1.0 (up to 2.5 GT/s) routed to CPCI J3/P3 connector, supporting up to x4 devices
•XMC, compatible with ANSI/VITA 42.3 specification

PCI-E bus (for CPC503-02)
•PCI-E 3.0 (up to 8 GT/s) routed to P15 XMC connector, supporting up to x8 devices
•PCI-E 2.0 (up to 5 GT/s) routed to CPCI J3/P3 connector, supporting up to x4 devices
•XMC, compatible with ANSI/VITA 42.3 specification

SMBUS
•Compatible with 2.0 specification
•Speed up to 100 Kb/s

GPIO interface
•8x lines
•Routed to RIO

FLASH BIOS
•64 MB SPI-Flash

NAND FLASH-drive
•Integrated four channel NAND controller (up to 100 MB/s)
•NAND soldered: 4 GB (CPC503-01), 8 GB (CPC503-02)
•Connected to SATA6 interface

SATA interface
•Single interface routed to P16 XMC
•Single interface is used for the connection of HDD 1.8" (installed on board)
•Two interfaces, routed to RIO

SPI interface
•Support of FRAM

•Frequency up to 25 MHz

4x LAN 10/100/1000 Mb ports on PCI-E x4 Gen2
•2xswitchable between P16 XMC and RIO
•2xrouted to the front panel
•Support of PICMG 2.16 standard
•Implementation of a server network adapter

USB ports
•Support of USB 1.1 (12 Mb/s), USB 2.0 (480 Mb/s)
•Connection of up to 4x devices via connectors on the front panel
•2xinterfaces are routed to P16 XMC
•2xUSB 3.0 interfaces are routed to P16 XMC (for CPC503-02)
•6xinterfaces are routed to RIO

FRAM
•32 KB: 1 KB for storing Bios Setup settings and 31 KB for saving user data
•Implemented on SPI bus

RTC
•Lithium battery CR2032 (3 V) power supply

Audio support
•HD Audio interface routed to P16 XMC and RIO connectors

Watchdog timer
•Internal, programmable watchdog

Hardware monitor
•Implemented via PECI/SMBUS interfaces;
•Monitoring of 3 supply voltages;
•Monitoring of CPU temperatures;
•Monitoring of PCB temperature.
Support of XMC/PMC extension boards
•Support of a single XMC/PMC extension board
•PCI bus-X 64 bit/133 MHz routed to P1-P4 PMC connectors (ANSI/VITA 39, PCI-X on PMC)
•PMC I/O P4 routed to RIO (PICMG 2.0)
•PCI-E bus x8 Gen2 routed to P15 XMC connector (ANSI/VITA 42.3, XMC PCI Express Protocol Standard) (for CPC503-01)
•PCI-E bus x8 Gen3 routed to P15 XMC connector (ANSI/VITA 42.3, XMC PCI Express Protocol Standard) (for CPC503-02)
•Additional interfaces (1xSATA, 2xUSB, LPC, HD-Audio, 2xEthernet) are routed to P16 XMC connector. For CPC503-02: 2xUSB 3.0

LEDs
•Board start diagnostics LED / “Hot Swap” LED
•SATA addressing LED
•Two programmable LEDs (user LEDs)

OS compatibility
•Linux 2.6
•QNX 6.5
•Windows Embedded Standart 7

Power
•Supply voltage +5 V, +3.3 V, +12 V, -12 V from CPCI bus

Mechanical
•Single shock/vibration resistance: 30g/2g
•Dimensions: 266,1 mm x 212,5 mm x 21 mm (with R1 heat-sink);
266,1 mm x 212,5 mm x 42 mm (with R2 heat-sink)
•Wight: with R1 heat-sink: no more than 0,700 kg; with R2 heat-sink: no more than 0,960 kg
•MTBF: no less than 60 000 hours

Environmental
•Operating temperature range
Industrial: from -40°C to +85°C; Commercial: from 0°C to +70°C

•Resistance to cyclic damp heat in case of conformal coating:
at the ambient temperature of +(55 ± 2)°C, relative humidity (93 ± 3)%

Delivery checklist
1.CPC503 Module
2.Fastening elements for installing HDD:
-Fixing device1 pcs.
- DIN7985 M2 screw 5x62 pcs.
-DIN6798A washer 2,52 pcs.
3.Package

Device Type
CPC503 6U CompactPCI Intel Core i7 SBC Processor
Processor
i72C1.7Corei73517UE, 2C,1,7 GHz, 17 W, ULV
i72C2.5Corei73555LE, 2C,2,5 GHz, 25 W, LV
i74C2.1Corei73612QE, 4C,2,1 GHz, 35 W, SV
Soldered Memory
RAM4G 4GB RAM8G 8GB
Temperature Range
IIndustrial Range, -40...+85°C
CCommercial Range, 0...+70°C

Option
Protective Coating *
Ver. 01.06 2014